Download PDF by Ho-Ming Tong,Yi-Shao Lai,C.P. Wong: Advanced Flip Chip Packaging

By Ho-Ming Tong,Yi-Shao Lai,C.P. Wong

Advanced turn Chip Packaging offers previous, current and destiny advances and tendencies in components corresponding to substrate know-how, fabric improvement, and meeting tactics. turn chip packaging is now in common use in computing, communications, customer and car electronics, and the call for for turn chip expertise is continuous to develop to be able to meet the necessity for items that provide higher functionality, are smaller, and are environmentally sustainable.

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Advanced Flip Chip Packaging by Ho-Ming Tong,Yi-Shao Lai,C.P. Wong


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